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FED-Conference in Bamberg in September 2018

This year, the FED again invites all interested to join their conference in Bamberg. Method Park contributes to the presentation track “Development & Design” with an experience report from practice in agile hardware.

The Association for Design, Printed Circuit Boards and Electronics Manufacturing (FED) hosts its 26th annual conference. This year’s motto is “Design and Production Processes for Smart Electronics”.

In their common presentation, Dr. Tobias Kästner, Expert Software Engineer at Method Park, and Mario Blunk of Blunk electronic demonstrate how to develop hardware and firmware in an agile way.

The program of both conference days includes 45 presentations and is divided into four parallel tracks with the topics Management, Development & Design, Manufacturing & Test and Multifunctional Printed Circuit Boards. The keynote of the first day, “Artificial Intelligence in Manufacturing”, is presented by Prof. Sami Haddadin, robotics researcher and expert for artificial intelligence. The keynote of the second day, presented by Peter Brandl, professional pilot, flight instructor and management consultant, deals with the thrust lever for corporate culture in the 21st century. A flyer gives an overview of the agenda. 

In addition to specialist presentations, the FED Conference offers its participants an accompanying exhibition with 40 exhibitors to exchange knowledge and experience. It furthermore offers several possibilities to expand professional networks, for instance during the festive evening on September 27 or the award ceremony of the PCB award.

Date:
September 27 – 28, 2018

Location:
Welcome Kongresshotel Bamberg
Mußstraße 7
96047 Bamberg, Germany

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